发明名称 DRESSING METHOD AND DEVICE FOR GRINDING WHEEL ON DOUBLE SIDE PROCESSING DEVICE FOR WAFER
摘要 PROBLEM TO BE SOLVED: To efficiently dress a grinding wheel for both side grinding and make its bus bars in parallel with each other in high precision by making a pair of grinding wheels for grinding which rotate approach each other while making them contact with a grinding wheel for dressing between them and reciprocating the grinding wheel for dressing in the rotation axis direction of both of the grinding wheels for grinding. SOLUTION: Grinding wheels 24 for grinding are fixed in the circumference of a grinding wheel rotation axis 22. Dimensions of a clearance between the grinding wheels 24 for grinding are optionally adjusted by sliding and driving both of movable carriages 18 in opposite directions to each other by actuation of a grinding wheel delivery motor 28. Additionally, the grinding wheels 24 for grinding are driven to rotate in a specified direction around the grinding wheel rotation axis 22 as their center by actuation of a grinding wheel driving motor. Furthermore, a grinding wheel holding bar 56 is extensively provided downward from a ramp 54, and a grinding wheel 58 for dressing is fixed on its lower end. Its end surface is formed in a recessed curved shape to coincide with an outer peripheral surface of each of the grinding wheels 24 for grinding. Thereafter, a position of the whole of a dressing device 50 is set so that both end surfaces of the grinding wheel 58 for dressing simultaneously make contact with the outer peripheral surfaces of both of the grinding wheels 24 for grinding.
申请公布号 JPH10217118(A) 申请公布日期 1998.08.18
申请号 JP19970024072 申请日期 1997.02.06
申请人 TOYO A TEC KK;SHIN ETSU HANDOTAI CO LTD 发明人 HIRANO TAMEYOSHI;HANDA KANJI;HASEGAWA FUMIHIKO;TSUCHIYA TOSHIHIRO
分类号 B24B53/04 主分类号 B24B53/04
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