| 摘要 |
An electrical plug has a multiplicity of contact terminals disposed on a wafer that is received within a housing. The wafer or substratum is grooved or channeled between each contact terminal. In this manner, the contacting surface of each terminal is essentially raised from the surface of the substratum. Generally, the groove takes the form of a modified V shape, however, other groove configurations may be utilized. By lowering the substratum surface during formation of the wafer, the contact surface of each terminal becomes elevated from the substratum surface, while remaining at the same height relative to each other. Any misregistration or misalignment of the terminals of the receptacle caused by tilting, twisting or otherwise that would cause an open circuit or poor contact is alleviated by the channel. The misaligned receptacle terminal is allowed to tilt and be received into the channel rather than contacting the substratum surface to be held away from contact.
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