发明名称 |
High-speed planarizing apparatus and method for chemical mechanical planarization of semiconductor wafers |
摘要 |
The present invention is a high-speed planarizing machine with a platform that holds the upward facing wafer stationary during planarization, and a carrier positioned opposite the platform. The carrier rotates about an eccentric axis and translates in a plane that is substantially parallel to the wafer. A polishing pad is smaller in diameter than the wafer and is attached to the carrier and positioned opposite the wafer. The carrier rotates and translates the polishing pad across the wafer while the wafer is held stationary.
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申请公布号 |
US5792709(A) |
申请公布日期 |
1998.08.11 |
申请号 |
US19950574492 |
申请日期 |
1995.12.19 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
ROBINSON, KARL M.;STROUPE, HUGH |
分类号 |
B24B37/04;(IPC1-7):C23F3/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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