MEMBER FOR BALL GRID ARRAY SEMICONDUCTOR PACKAGE, ITS MANUFACTURE, AND MANUFACTURE OF BALL GRID ARRAY SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a member for BGA semiconductor package which can be manufactured through a packaging process using ordinary manufacturing facilities, can be reduced in manufacturing cost, and can be improved in productivity by making the progress speed of the packaging process faster and a method for manufacturing a BGA semiconductor package utilizing the member. SOLUTION: A member for BGA semiconductor package is provided with a carrier frame having a plurality of platy saddles 21, side rails 22 and 22', and connecting sections 23 and substrates 43 which are bonded to each paddle 21 and have main bodies in which multilayered circuits are buried and through holes 42 at central parts. By utilizing this member for BGA semiconductor package, a BGA semiconductor package is manufactured by bonding semiconductor chips to the inside paddles 21 of the through holes 42 and electrically connecting the chips to the multilayered circuits through wires, and then, molding the semiconductor chips and wires.