| 摘要 |
PROBLEM TO BE SOLVED: To provide the photosensitive resin composition developable with an alkaline solution and enhanced in heat resistance, solvent resistance, flexibility, electric nonconductance, and dielectric characteristics by composing the composition with a specified polyamido acid and a compound having photopolymerizable -C=C- bond and a photopolymerization initiator. SOLUTION: This photosensitive resin composition comprises a mercaptan compound having an alcoholic hydroxyl group on the molecular chain and the polyamido acid obtained by reaction of a tetracarboxylic acid anhydride with a diamine and the compound having a photopolymerizable -C=C- bond and the photopolymerization initiator. It is preferred that the polyamidoacid is mixed with a mercaptan compound having a thiol group on the molecular chain. The mercaptan compound having the alcoholic hydroxyl group on the molecular chain performs ring-opening reaction between its alcoholic hydroxyl group and the tetra-carboxylic acid anhydride and further the thiol group performs cross-linking reaction with the compound having the -C=C- bond. |
