| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition hardly influenced by moisture absorption, especially excellent in moisture resistance and heat resistance to soldering after the immersion in soldering bath, free from release between the sealing resin and semiconductor chip, etc., and capable of assuring a long-term reliability by using a specific epoxy resin and a specific phenol resin. SOLUTION: This resin composition consist essentially of (A) a polyfunctional epoxy resin having biphenyl skeleton and phenol skeleton and represented by formula I [(n) is 0 or >=1 integer], (B) an aralkyl type phenol resin of formula II, (C) an inorganic filler (preferably silica powder, preferably low in impurity concentration and having <=30μm average particle) and (D) a curing accelerator (e.g. imidazole-based curing accelerator) and contains the component C in a ratio of 25-93wt.% based on the resin composition. The compounding ratio of the component D is preferably 0.01-5wt.% based on the resin composition.
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