| 摘要 |
Electronic interconnection of two printed wiring structures. Two printed wiring boards (11, 16) or a flexprint circuit (20) and a printed wiring board (11) are interconnected by creating a plated hole pattern (12) on a surface (12) of the p rinted wiring board (11), and wherein holes (13) of the pattern (12) have a concave cro ss section. The holes (13) of the plated hole pattern (12) are mated with correspon ding bumps (17) or dimples (17) disposed on the second printed wiring board (16) or t he flexprint circuit (20). The holes (13) formed in the first printed wiring board (11) are disposed a predetermined depth below a surface (18) of the printed wiring board (11), typically to a depth of between 0.007 inches and 0.020 inches below the surface. The plurality of plated holes (13) are formed by electroless plating or electroplati ng of the holes (13). The present interconnection structure (10) provides for reliable and self aligning interconnection of the two printed wiring boards (11, 16) or the flexpr int circuit (20) and printed wiring board (11). |
