| 摘要 |
A dental resin composition is presented, comprising an ethoxylated bisphenol A dimethacrylate having the formula CH2=C(CH3)CO2(C2H4O)xC6H4C(CH3)2C6H4(OC2H4)yO2CC(CH3)=CH2 wherein x + y is an integer from 1 to 20, and preferably from 2 to 7, together with a methacrylate oligomer and an optional diluent monomer. The composition is suitable for use for dental fillers adhesives, and the like, and has improved water sorption and excellent wear resistance. |
