| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce the number of manufacturing process steps without forming any hole in conductor layers, by laminating an insulator layer and the conductor layers, forming a hole in the conductor layers and the insulator layer by laser irradiation, and electrically connection the conductor layers together through the hole. SOLUTION: In a lamination method of a multilayer interterconnection board, an insulator 2 is positioned in a circuit board 7 with a desired circuit 1 formed thereon and metal foil 1b, and they are stacked up, and it is heated and pressed in vacuum, and the metal foil, insulator and circuit board are brought into tight contact with one another and laminated. To form a hole 4, laser 3 is applied to a hall in a desired position, and thus the metal foil as conductor layer and the insulator as insulator layer are melted and sublimed to form the hole. For electric connection between conductors for the hole 4, etching back, for example, is performed to remove smearing from inside the hall, and connection is provided by electroless plating or the like.</p> |
