发明名称 Bonding sole to insole upper of footwear, without additional bonds
摘要 Bonding the sole to the insole upper of footwear, comprises forming at least one recess (5) in the sole area of the insole upper (1, 4). A plastics material is poured into the recess (5), to harden and anchor the sole (2) to the insole upper (1, 4). The plastics can flow into the recess while the sole is injection moulded. Preferably the sole (2) is polyurethane, thermoplastic polyurethane, "Pebax" (RTM) or polyvinyl chloride.
申请公布号 DE19701180(A1) 申请公布日期 1998.07.16
申请号 DE19971001180 申请日期 1997.01.15
申请人 ADIDAS AG, 91074 HERZOGENAURACH, DE 发明人 DORSCH, THEODOR, 96164 KEMMERN, DE
分类号 B29D35/06;(IPC1-7):A43B9/12;B29D31/50 主分类号 B29D35/06
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