| 摘要 |
<p>A semiconductor device provided with a line of first pads (1A) and second pads (1B) arranged along one side edge on the element forming surface of a rectangular semiconductor chip (1). First leads which are respectively connected to the first pads (1A) are extended in a first direction crossing the line of the first and second pads (1A and 1B) and overhung second leads (6B) respectively connected to the second pads (1B) are arranged in a second direction which is the same as the line of the pads (1A and 1B) between a plurality of second pads (1B) and a plurality of first leads. In addition, the first leads and overhung second leads (6B) are supported by a heat radiating plate (2) with an insulating adhesive film in between.</p> |
