发明名称 |
MOLDED PLASTIC SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER |
摘要 |
There is provided a molded plastic electronic package having improved thermal dissipation. A thermal dissipator, such as a heat spreader or a heat slug is partially encapsulated in the molding resin. The thermal dissipator has a density less than that of copper and a coefficient of thermal conductivity that is constant or increases as the package periphery is approached. |
申请公布号 |
EP0771473(A4) |
申请公布日期 |
1998.07.15 |
申请号 |
EP19950924756 |
申请日期 |
1995.06.29 |
申请人 |
OLIN CORPORATION |
发明人 |
MAHULIKAR, DEEPAK;TYLER, DEREK, E.;BRADEN, JEFFREY, S.;POPPLEWELL, JAMES, M. |
分类号 |
H01L23/28;H01L23/12;H01L23/29;H01L23/31;H01L23/373;H01L23/433 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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