发明名称 Thermally reworkable binders for flip-chip devices
摘要 A semiconductor device is attached to a supporting substrate by a plurality of solder connections that extend from the supporting substrate to the semiconductor device and the gap between the supporting substrate and the semiconductor device is filled with a reworkable composition comprising: (a) a thermally reworkable crosslinked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and (b) at least one filler present in an amount from about 25 to about 75 percent by weight based upon the amount of components (a) and (b). Such a process provides a readily reworkable semiconductor assembly.
申请公布号 AU5761298(A) 申请公布日期 1998.07.15
申请号 AU19980057612 申请日期 1997.12.15
申请人 SHELL INTERNATIONALE RESEARCH MAATSCHAPPIJ B.V. 发明人 SHRIDHAR RATNASWAMY IYER;PUI KWAN WONG
分类号 C08L73/00;C08G67/02;H01B3/44;H01L21/56;H01L23/29;H01L23/31;H05K3/34 主分类号 C08L73/00
代理机构 代理人
主权项
地址