发明名称 Thermal reaction chamber for semiconductor wafer processing operations
摘要 <p>A thermal reaction chamber (30) for semiconductor wafer processing operations comprising: (i) a susceptor (36) for supporting a semiconductor wafer (38) within the chamber (32) and having a plurality of apertures (68,74) formed vertically therethrough; (ii) displacer means (35) for displacing the susceptor (36) vertically between at least a first and a second position; (iii) a plurality of wafer support elements (66), each of which is suspended within apertures (68,74) to be vertically moveable within said apertures (70) and each of which extends beyond the underside of the susceptor (36); and (iv) means (64) for restricting the downward movement of the wafer support elements (66). As the susceptor is displaced from its first position through an intermediate position before the second position, the means (64) for restricting operate to stop the continued downward movement of the wafer support elements (66) thereby causing the elements to move vertically upwards with respect to the downwardly moving susceptor (36) and separate the wafer (38) from the susceptor (36). &lt;IMAGE&gt;</p>
申请公布号 EP0852393(A2) 申请公布日期 1998.07.08
申请号 EP19980105302 申请日期 1994.02.28
申请人 APPLIED MATERIALS, INC. 发明人 PERLOV, ILYA
分类号 C23C16/44;C30B25/12;H01L21/00;H01L21/205;H01L21/324;H01L21/683;H01L21/687;(IPC1-7):H01L21/00 主分类号 C23C16/44
代理机构 代理人
主权项
地址