Diamond wafer and method of producing a diamond wafer
摘要
A diamond wafer including a substrate and a (100) oriented polycrystalline diamond film grown on the substrate for making surface acoustic wave devices, semiconductor devices or abrasion-resistant discs. The (100) oriented film is produced by changing a hydrocarbon ratio in a material gas halfway from a higher value to a lower value. The wafer is monotonously distorted with a distortion height H satisfying 2 mu m</=|H|</=150 mu m. The film is polished to a roughness of less than Rmax50 nm and Ra20 nm.