| 摘要 |
PROBLEM TO BE SOLVED: To remarkably reduce the specific resistance of conductor wiring layers by constituting the layers of the particles of a low-resistance metal and a thermosetting resin and press-contacting the particles with each other through the cure shrinkage of the resin by thermally curing the resin and, at the same time, discharge-welding the contacting sections of the particles to each other by impressing a pulselike current. SOLUTION: In an insulating layer 1 containing at least an organic resin, via hole conductors 3 in which metallic particles of copper, silver, aluminum, gold, etc., are coupled with each other with a thermosetting resin are formed by filling up via holes with conductor paste containing the metallic particles and thermosetting resin and coupling the particles with each other by curing the thermosetting resin. Then the contacting sections of the metallic particles are discharge-welded to each other by impressing a pulselike current upon the conductors 3. Thereafter, the specific resistances of the conductors 3 are reduced by electrically heating the conductors 3 after or simultaneously with the discharge-welding process. |
