发明名称 Surface acoustic wave device and production process thereof
摘要 This invention relates to a surface acoustic wave device and a production process thereof. An electrode is formed by alternately laminating a film of an aluminum alloy containing at least copper added thereto and a copper film on a piezoelectric substrate. While the particle size of the multi-layered electrode materials is kept small, the occurrence of voids in the film is prevented and life time of the surface acoustic wave device is elongated.
申请公布号 US5773917(A) 申请公布日期 1998.06.30
申请号 US19970863026 申请日期 1997.05.23
申请人 FUJITSU LIMITED 发明人 SATOH, YOSHIO;IKATA, OSAMU;UCHISHIBA, HIDEMA;MATSUDA, TAKASHI;NISHIHARA, TOKIHIRO;TAKANATSU, MITSUO;TANIGUCHI, HAJIME
分类号 H01L21/60;H03H3/08;H03H9/145;(IPC1-7):H01L41/08 主分类号 H01L21/60
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