发明名称 |
Surface acoustic wave device and production process thereof |
摘要 |
This invention relates to a surface acoustic wave device and a production process thereof. An electrode is formed by alternately laminating a film of an aluminum alloy containing at least copper added thereto and a copper film on a piezoelectric substrate. While the particle size of the multi-layered electrode materials is kept small, the occurrence of voids in the film is prevented and life time of the surface acoustic wave device is elongated.
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申请公布号 |
US5773917(A) |
申请公布日期 |
1998.06.30 |
申请号 |
US19970863026 |
申请日期 |
1997.05.23 |
申请人 |
FUJITSU LIMITED |
发明人 |
SATOH, YOSHIO;IKATA, OSAMU;UCHISHIBA, HIDEMA;MATSUDA, TAKASHI;NISHIHARA, TOKIHIRO;TAKANATSU, MITSUO;TANIGUCHI, HAJIME |
分类号 |
H01L21/60;H03H3/08;H03H9/145;(IPC1-7):H01L41/08 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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