| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor package which can ensure the precision of the bonding position of a heat radiating plate, while using a solder sheet easy to automate the bonding of a heat radiating plate. SOLUTION: In a manufacturing method of a semiconductor package wherein, on the single surface of a circuit board 20b in which an aperture part 14 is formed, a heat radiating plate 30 for closing the aperture part 14 is bonded to a conductor part 26c formed in the periphery of the aperture part 14 via solder, and a cavity for mounting a semiconductor element is formed, the single surface of the circuit board 20b is covered with solder resist 28, the conductor part 26c is so formed that the outer peripheral form is along the outer peripheral form of a solder sheet 56 formed in a frame type and exposed comparatively larger than the external form of the solder sheet 56, it is mounted inside the outer periphery of the conductor part 26c, and the heat radiating plate 30 is mounted on the solder sheet 56 and bonded by heating.</p> |
