COMPOSITION FOR POLISHING

摘要

PROBLEM TO BE SOLVED: To suppress a decrease in speed for polishing a surface to be polished even after repetitive use by specifying an electric conductivity of a composition for polishing containing colloidal silica, a nitrogen-containing basic compound, and water. SOLUTION: This composition for polishing is adjusted by mixing and dispersing or dissolving colloidal silica and a nitrogen-containing basic compound with/to water at a desired percentage content. The colloidal silica is aqueous colloidal silica or gel silica each including all of stable dispersing elements of amorphous silica in a liquid and its percentage content is preferably 0.1 to 30wt.% of the total quantity of the composition for polishing. The nitrogen basic compound promotes polishing to a surface to be polished by a chemical action and also acts as a dispersant of colloidal silica. Ammonia is typical of the compound and its content is preferably 0.01 to 5wt.%. Further, the electric conductivity of the composition for polishing is 30 to 1500μS/cm.