| 摘要 |
PROBLEM TO BE SOLVED: To perform chemical-mechanical grinding which is excellent in grinding speed and grinding uniformity by making composition contain grinding abrasive grain, isopropyl alchol and water. SOLUTION: The grinding of the surface of a wafer 101 is performed by passing abrasive material composition through a rotary shaft 103 by fixed pressure, self-revolving a pad 104, supplying abrasive material composition between the wafer 101 and the pad 104 via a hole 201 formed on the pad 104, and rotationally revolving the wafer 104 and rotating as well as horizontally oscillating the wafer 101. Abrasive material composition in which silica of particle diameter 30 to 250nm (SiO2 ) is dispersed in liquid made of water of various kinds of ratios and isopropyl alchol is used. By adding isopropyl alchol, adsorption of abrasive material to the pad 104 is suppressed. As a result, grinding abrasive grain is supplied to the whole of the contact surface of the pad 104 and the wafer 101, and grinding uniformity and grinding speed are improved. |
