| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device and method enhancing polishing rate by vibrating at least either one of a lower surface plate or a pressurizing ele ment at a predetermined frequency. SOLUTION: Work 200 is placed on a lower surface plate 1, and as a polishing liquid K is supplied from a polishing liquid supply nozzle 4 while the work 200 is being pressed by a pressure plate 3, the lower surface plate 1 and the work 200 are rotated in opposite directions to polish the work 200. Then, by vibrating the lower surface plate 1 by means of a vibrating mechanism 2 provided below time lower surface plate 1, abrasives in the polishing liquid K are uniformly dispersed between the work 200 and the lower surface plate 1 and made to deeply bite into the lower surface of the work 200, whereby the rate of polishing the work 200 is enhanced. |
