发明名称 Dual contact probe assembly for testing integrated circuits
摘要 An assembly for making electrical connections to unpackaged integrated circuits using dual contact probes. The probes are said to be dual contact because they contact both the integrated device under test and the testing circuit. The probes have two tips. One tip is located at the end of each leg of the "U"-shaped probe. In operation, the probes are oriented with the legs of the probes extending horizontally and the tips pointing up and down, contacting the IC under test and the testing circuit. The probes are each made of a single piece of metal, and so provide an electrical connection between the IC and testing circuit. Flexing in the legs provides springiness for assuring good contact. The probes are mounted on a rigid block that is rigidly connected to the testing circuit and IC under test. Alignment plates are used to accurately position the probes. The plates can be horizontal or vertical and they have holes or slots that engage parts of the probes. The holes and slots are placed to provide proper positioning of the probes.
申请公布号 US5764072(A) 申请公布日期 1998.06.09
申请号 US19960771274 申请日期 1996.12.20
申请人 PROBE TECHNOLOGY 发明人 KISTER, JANUARY
分类号 G01R31/28;(IPC1-7):G01R31/02 主分类号 G01R31/28
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