Semiconductor device with bent electrode terminal

摘要

A container has an upper opening, a plurality of semiconductor elements and electrode terminals connected to the semiconductor elements. A cover member closing the opening has insertion holes formed therethrough from its lower surface to its upper surface. The cover member is coupled with the container by inserting the electrode terminals through the insertion holes to make them vertically project from the upper surface, and bending the projecting electrode terminals. The cover member has projections provided adjacent to the insertion holes. Each of the vertically projecting electrode terminals is bent through more than 90 DEG over a corresponding one of the projections, with its bent corner portion supported on the edge of the projection, and arranged parallel to the upper surface of the cover member as a result of a spring back effect.