CERAMIC MULTILAYER WIRING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To easily form a micro wiring by providing signal wirings for connecting one group of a wiring pad and an external connection terminal and detaching the signal wirings in upper/lower direction so as to arrange them. SOLUTION: One wire bonding pad 16 and one external connection pin 15 are connected by two signal wirings 21a and 22a. The vertical distance between the signal wiring 21a and the signal wirings 22a is set to be d1 , the width between the signal wirings 21a and 22a to be d2 , the pitch between the signal wiring 21a and the signal wiring at the left to be d3 , the size of lateral deviation between the signal wiring 21a and the signal wiring 22a positioned at a lower part to be d4 and the distance between a ground layer 20 and a power source layer 23 as D1 . Thus, the deterioration of the signal characteristic can be prevented and the micro wiring can be formed.