| 摘要 |
<p>PROBLEM TO BE SOLVED: To surely applying pressure at the time of bonding to an insulating tape end portion and a part where an inner lead interval is wide. SOLUTION: Inner lead part 2 groups of a lead frame 1 are bonded to the upper surface of a semiconductor chip 3 by using an insulating tape divided into four parts. The insulating tape is formed so as to be accommodated in a plane surrounded by the tip parts of the inner lead part 2 groups and a bus bar 6. In the part where the interval of the inner lead part 2 is wide, protrusions 4 are formed from the bus bar 6 to the inner lead direction, and the effect simular to that the interval of the lead part groups 2 is narrowed is practically obtained. Thereby a part which is not yet bonded between the insulating tape and the semiconductor chip 3 is excluded, when the insulating tape and the semiconductor chip 3 are bonded. The inner lead part 2 groups and the semiconductor chip 3 are rigidly bonded. Peeling of the semiconductor chip 3 from the inner lead part 2 groups, breakdown of the semiconductor chip 3 and deterioration of the reliability of the semiconductor chip 3 which are to be caused by bonding pressure in a later wire bonding process can be prevented.</p> |
