METHOD FOR MINIMIZING PINK RING IN BLIND LASER VIAS

摘要

A method of forming a via in a laminated substrate by forming a copper oxide layer on a copper layer of the substrate by immersing the substrate in a copper oxide bath solution for between 30 seconds to 5 minutes. A dielectric layer is formed on the copper oxide layer. The via is laser drilled in substrate. The photo-absorptive layer and the ablated redeposited material on the photo-absorptive layer is then removed.