| 摘要 |
<p>A package (12) for mounting an integrated circuit chip (18) includes a body having at least a first region and a second region. The first region (12A) has a first coefficient of thermal expansion (CTE), and the second region has a second, different CTE. The first region (12A) approximately matches the CTE of the integrated circuit chip (18) mounted on the package (12), and the second region approximates the CTE of the printed wiring board (40) to which the package is mounted.</p> |
