发明名称 METAL VAPOR DEPOSITION FILM LAMINATE AND PACKAGING BAG FOR ELECTRONIC MATERIAL USING IT
摘要 PROBLEM TO BE SOLVED: To provide a metal vapor deposition film laminate permitting the transmission of light, capable of looking packaged content from the outside, capable of being simply heat-sealed and having low steam permeability, and a packaging bag for an electronic material using it. SOLUTION: The metal vapor deposition film laminate is constituted by successively laminating a polyethylene film layer (layer A), a barrier resin film layer (layer B) and a resin film layer (layer C), wherein the resin film layer (layer C1) is composed of a resin base material film layer (layer C1), a metal vapor deposition layer (layer C2) and a protective organic matter layer (layer C3), and wherein the protective organic matter layer (layer C3) is a surface layer. The light transmittance of this laminate is 35% or above. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007175986(A) 申请公布日期 2007.07.12
申请号 JP20050376552 申请日期 2005.12.27
申请人 SHOWA HIGHPOLYMER CO LTD 发明人 HASEGAWA KATSUHIKO;YOSHIDA SATORU
分类号 B32B27/32 主分类号 B32B27/32
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