METHOD FOR USING ULTRASONIC TREATMENT IN COMBINATION WITH UV-LASERS TO ENABLE PLATING OF HIGH ASPECT RATIO MICRO-VIAS

摘要

A method of forming a via in a laminated substrate by forming ablated material by laser drilling a via in a laminated substrate. The ablated material is deposited on a sidewall of the via. An ultrasonic treatment is applied to the drilled substrate thereby removing ablated material redeposited on sidewalls of the via.