| 摘要 |
<p>A method of forming a via in a laminated substrate by applying a polymeric photoabsorptive layer on an exposed surface of a laminated substrate. Ablated material is formed by laser drilling a via in the substrate through the photoabsorptive layer. The ablated material is redeposited on the photoabsorptive layer surrounding the via. The entrance of the via is enhanced by removing the photoabsorptive layer and the ablated redeposited material on the photoabsorptive layer.</p> |
