发明名称 Method and apparatus for temperature compensated optical sensor mounting
摘要 A method and apparatus for mounting an optical sensor in an optical instrument. The optical sensor is attached to a rigid substrate. The substrate has two locator holes, with the sensor mounted between the holes. Rigid locator pins attached to the housing of the instrument protrude into the locator holes. A spring pushing against the substrate forces the locator holes against corresponding locator pins, aligning the substrate within a plane. In a first embodiment, the holes are positioned so that the optical sensor is rigidly held at its midpoint, minimizing dimensional deviations along the length of the sensor with temperature change. The sensor assembly is easily removable and the mounting apparatus does not mechanically stress the substrate or the sensor with temperature changes. The mounting apparatus is easily manufactured, allows precise alignment, and is inexpensive.
申请公布号 US5750978(A) 申请公布日期 1998.05.12
申请号 US19960598718 申请日期 1996.02.08
申请人 HEWLETT-PACKARD COMPANY 发明人 KRAICZEK, KARSTEN G.;EFFELSBERG, UWE
分类号 G01J1/02;G01J1/04;G01J1/42;G01J3/02;G01J3/28;H01L31/02;(IPC1-7):H01J3/14 主分类号 G01J1/02
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