Method for the simultaneous annealing and cleaning of metallic or dielectric lines on a substrate

摘要

A method is claimed for the simultaneous annealing a deposited metallic or dielectric line (33) and eliminating the metallic debris deposited in the neighbourhood of this line (33). The method comprises the following steps: (a) generating an ultraviolet laser beam (31); (b) focusing this ultraviolet laser beam on the line (33); and (c) exposing the line (33) to the ultraviolet laser beam over a period of time sufficient to melt and restore the shape of the line and to evaporate the small particles of debris in the neighbourhood of the line (33). The method is also used to rectify the deposited metallic or dielectric line (33) at the same time using a process of laser ablation and projection of a metallic deposit.