| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multi-layer printed wiring board for mounting IC, which can firmly fix a heat sink on its laminate side by soldering, and also can firmly fix an IC to the heat sink with resin adhesive. SOLUTION: A heat sink 46 is made up of a copper plate 60, a nickel layer 62 plated on the copper plate 60, a palladium layer 64 plated on the nickel layer 62. That is, the palladium layer is provided as an outermost layer. Since palladium is high in solderability and is higher in adhesion to resin adhesive than gold. For this reason, the heat sink 46 can be firmly fixed to a side of a laminate provided with a conductive circuit 14f by means soldering 54, and an IC 52 can be firmly fixed to the heat sink 46 with resin adhesive 56.</p> |
