WRAPPING DEVICE OF SEMICONDUCTOR WAFER AND WRAPPING METHOD USING IT

摘要

PROBLEM TO BE SOLVED: To prevent deformation of a surface plate caused by repeating wrapping by suddenly changing rotating speed of a wrapping carrier so as to induce rotation of a semiconductor wafer in a holding hole of the wrapping carrier. SOLUTION: A detection gauge 20 to detect flatness of a surface of a lower surface plate 3 is arranged in the neighbourhood of the lower surface plate 3, and this detection result is input to a control means 60 so as to control reciprocal rotation time in accordance with this detection result. The control circuit 60 improves overall thickness variation of a semiconductor wafer by controlling rotation of a wrapping carrier 4 and increasing a region to be wrapping by marginal parts of the upper and lower surface plates 31, 3 so as to induce rotation of the semiconductor wafer 10 by suddenly changing a rotation difference of a sun gear 51 and an internal gear 52. Additionally, it is possible to prevent deterioration of flatness due to a shape of the surface plate.