发明名称 |
Method of manufacturing an integrated electro-optical package |
摘要 |
An integrated electro-optical package including a plurality of organic light emitting devices (LEDs) directly interconnected to external driver circuits utilizing a printed circuit board, having formed therein a plurality of plated through-hole vias and a method of fabricating the integrated electro-optical package. The organic LEDs are fabricated on a supporting substrate and include vertical interconnections to driver and control circuits mounted on an uppermost surface of a printed circuit board (PCB). The vertical interconnections are formed utilizing plated through-hole conductive vias formed in the printed circuit board, conductive leads, and conductive epoxy. A hermetic seal is formed by positioning a sealing ring formed on the printed circuit board in sealing contact with a sealing area on the surface of the substrate so as to hermetically seal the organic light emitting devices.
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申请公布号 |
US5747363(A) |
申请公布日期 |
1998.05.05 |
申请号 |
US19970889724 |
申请日期 |
1997.07.08 |
申请人 |
MOTOROLA, INC. |
发明人 |
WEI, CHENGPING;SHI, SONG Q.;LEE, HSING-CHUNG |
分类号 |
G09F9/33;H01L25/16;H01L27/32;H01L33/00;H01L51/50;(IPC1-7):H01L21/20 |
主分类号 |
G09F9/33 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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