SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, CIRCUIT BOARD, AND FLEXIBLE SUBSTRATE

摘要

A semiconductor device which can be guaranteed for quality and can be handled easily and in which the electrodes of a semiconductor chip can be joined collectively to a flexible substrate, a method for manufacturing the semiconductor device, a circuit board, and a flexible substrate. A gap holding member (16) is provided on the surface of the flexible substrate (12) on which a joining section (24) which joins the substrate (12) to the electrodes (14) of the semiconductor chip (10) is positioned and the member (16) is interposed between the chip (10) and a substrate (12). Then, the joining section (24) on the substrate (12) is joined to the electrodes (14) of the chip (10) and a stress absorbing layer (26) is formed by injecting a moulding material into the space between the substrate (2) and the chip (10).