| 摘要 |
The components etc. with functional elements are electrostatically bonded on a support plate (1) made of ceramic substrate, insulating even at high temperature. It contains a glass film (3), which can be structured and bonded and is thin, as compared with the wafer thickness, on the side (1a) facing the functional elements. Preferably the support plate and/or the glass film carries an electrically conductive layer (2), in the case of the support plate in the glass film direction. On the rear side, away from the glass film, the support plate locates an electrically conductive layer. The plate and glass film may have apertures for contacting the two conductive layers.
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| 申请人 |
ERLER, KLAUS, DR.-ING., 09127 CHEMNITZ, DE;HAHN, RAMON, DIPL.-ING., 09126 CHEMNITZ, DE;SCHLEGEL, CARSTEN, DIPL.-ING., 09119 CHEMNITZ, DE;EBEST, GUNTER, PROF. DR.-ING., 09130 CHEMNITZ, DE;GESNER, THOMAS, PROF.DR.ING.HABIL., 09113 CHEMNITZ, DE;KAUFMANN, CHRISTIAN, DR.-ING., 09217 BURGSTAEDT, DE |
发明人 |
ERLER, KLAUS, DR.-ING., 09127 CHEMNITZ, DE;HAHN, RAMON, DIPL.-ING., 09126 CHEMNITZ, DE;SCHLEGEL, CARSTEN, DIPL.-ING., 09119 CHEMNITZ, DE;EBEST, GUNTER, PROF. DR.-ING., 09130 CHEMNITZ, DE;GESNER, THOMAS, PROF.DR.ING.HABIL., 09113 CHEMNITZ, DE;KAUFMANN, CHRISTIAN, DR.-ING., 09217 BURGSTAEDT, DE |
