| 摘要 |
PROBLEM TO BE SOLVED: To provide the BGA semiconductor device with good electric connection by taking the notice of a glass transfer temperature Tg in sealing resin, to suppress warp from occurring in a BGA(ball grid array) device. SOLUTION: A semiconductor chip 2 which is electrically connected with circuit wiring is loaded on a wiring substrate 1, having circuit wiring and a second sealing resin 5 the glass transfer temperature Tg of which is higher than the solder melting temperature of a solder bump 7 for suppressing the warp of the BGA semiconductor device is provided on a first sealing resin 4 sealing the semiconductor chip 2. The thermal expansion of first sealing resin 4 can be suppressed by second sealing resin 5 and the wiring substrate 1, which do not thermally expand much, even if the first sealing resin 4 attempts to thermally expand at the time of mounting the BGA semiconductor device on a mounting substrate 8. |
