MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To manufacture a semiconductor device where electrodes opposed to each other are connected with each other with high reliability and securely. SOLUTION: A bump electrode and a terminal electrode opposite to each other are connected temporarily (102), and then sealing resin is injected (104), and the sealing resin is temporarily hardened (106). Hereby, the sealing resin is interposed between the bump electrode and the adjacent bump electrode. Then, the bump electrode and the terminal electrode are connected regularly (108), and then the sealing resin is hardened (110).