| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip package in which an air trap and an inner pore do not exist in a shaped package body and which has high reliability. SOLUTION: The inner lead of a semiconductor chip package 200 is so constituted that a dummy block lead 154, which extends from the end part of an outermost inner lead 152 and is integrally formed with the outermost inner lead 152, is given. The dummy block lead 154 is obliquely formed, and projecting parts and recessing parts are formed on a side. Furthermore, it has an extending part 140A extended from a tie bar 140 and the extending part 140 divided at plural parts, so as to give that spaces 140B. The extending part 140A of the tie bar 140 is obliquely formed, and the projecting parts and the recessing parts are formed on the side. |
