| 摘要 |
PROBLEM TO BE SOLVED: To suppress cracks and improve reliability by reducing stress generated to sealing resin. SOLUTION: An electrode 11 formed on an alumina board 1 and a semiconductor chip 3 are electrically connected through solder bumps 2, and a space between the board and the semiconductor chip 3 is filled with sealing resin 4. Thermal stress is reduced and cracks are suppressed by making the average ratio of (a/b) at 2 or less where, (b) is a height of a sealing resin periphery part 41 from the bottom edge plane of the semiconductor chip 3, and (a) is a distance between the outer circumference edge of a circumference part 41 within the same flat plane as the bottom edge plane of the semiconductor chip 3 and the bottom edge of the semiconductor chip 3.
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