| 摘要 |
PCT No. PCT/JP95/01622 Sec. 371 Date Apr. 5, 1996 Sec. 102(e) Date Apr. 5, 1996 PCT Filed Aug. 15, 1995 PCT Pub. No. WO96/05613 PCT Pub. Date Feb. 22, 1996In a semiconductor device comprising an IC chip (8) mounted on a circuit substrate (7) and sealed with a molding resin (11), corner resist films (6a, 6b, 6c, 6d) are formed at positions corresponding to a corner A of the IC chip (8) on the circuit substrate (7), and the corner A of the IC chip (8) is bonded to these corner resist films by using a die bond (9). A die pattern (3a) is exposed outside the corner resist films, and a power supply pattern (3b) is so formed to encompass their periphery. The power supply terminal, the die pattern (3a) and the power supply pattern (3b) are connected to the IC chip (8) of the corners of the IC chip is improved and peel is prevented. Furthermore, bonding of a large number of bonding wires for supplying power can be freely made.
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