| 摘要 |
<p>The invention concerns a two-dimensional photonic radiation sensor based on the technique of hybridising a sensing chip on a reading chip via a micro-bead network providing the electric and mechanical interconnection of the two chips, the sensing chip consisting of a two-dimensional structure of ixj pixels, an active epitaxial layer (41) on a substrate (40), each light-sensitive elemental component consisting of one N/P or P/N diode produced in the active layer (41), the contacting on the N or P zone being made at each pixel, and the contacting on the other P or N zone being common to all the diodes, in which the sensor comprises an intermediate layer (42) of large gap, optically and electrically transparent, located between the active layer (41) and the substrate (40).</p> |
