| 摘要 |
<p>A process for producing a chip, comprising the steps of:setting an object to be diced on a pressure sensitive adhesive sheet for producing chip comprising at least one layer of shrinkable film, an expansible film and a pressure sensitive adhesive layer for setting the object;fixing edges of the pressure sensitive adhesive sheet for producing chip;dicing the object into chips, andshrinking the shrinkable film to thereby expand chip spacings. In the process for producing small chips such as semiconductor chips, chip spacings can be expanded without the need to conduct the conventional expansion step.</p> |
