| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition having excellent dispersibility and sufficient thermal conductivity, and useful for heat-resistant materials, by adding boron nitride powder of specific aggregate particle size and average particle size of a specific or smaller value to a polyimide resin. SOLUTION: This polyimide resin composition is obtained by pulverizing boron nitride powder which is aggregates of flaky particles, as a material, through a jet pulverizer, dispersing the obtained boron nitride powder into N-methylpyrrolidone, etc., further feeding polyimide varnish into the mixture, stirring the mixture, evaporating off N-methylpyrrolidone, then filming the obtained varnish to a thin film of 40-50μm in thickness, thus producing the polyimide resin composition which contains the boron nitride powder having a specific surface area of 2-50m<2> /g, has excellent dispersibility and improved thermal conductivity, and is useful as a material for heat-resistant belts, printed- circuit substrates, etc.
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