COMPOSITIONS AND INSULATION BODIES HAVING LOW THERMAL CONDUCTIVITY

摘要

The present invention relates to particulate compositions having improved thermal conductivity values. An embodiment of the present invention is a particulate composition which under a 103421 Pa load, at 20 DEG C, and at a pressure (P) within the range of 133.322 - 13332.2 Pa, in Nitrogen, has: a packing density of less than or equal to 160 kg/m<3>, and a Thermal Conductivity (TC) at 133.322 - 1333 - 322 Pa of less than or equal to (0.260lnP + 4.53) milliWatt/meterK (mW/m.K) and a TC at 1333.322 - 13332.2 Pa of less than or equal to (0.824lnP + 0.47) mW/m.K. A preferred particulate composition is a gel composition. Also disclosed are insulation bodies comprising the particulate compositions.