PARTIAL PLATING DEVICE OF LEAD FRAME AND PARTIAL PLATING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a partial plating device of a sparger system which is a device free from plating and the migration of the back side occurrence of deformation of lead frames and has a trouble-free structure. SOLUTION: This partial plating device for the lead frames has a die pad which executes plating by covering the plating surface side of the lead frame 110 with masking jigs 120, pressing the surface side which is not the plating surface side of the lead frame 110 to the lead frame 110 by a press block 130, holding the lead frame by means of the masking jigs 120 and the press block 130 and spraying the plating liquid to the parts on the plating surface side of the lead frame, which parts are exposed from the aperture 120A of the masking jigs. In such a case, the outer periphery of the die pad and the surface of the press block in contact with the lead frame along the outer periphery of the aperture disposed at the die pad are provided with many microholes and are provided with pipings 131A communicating with these micropores. The plating is executed by sucking the die pad of the lead frame from the micropores via the pipings 131A by the suction means 150.