CONNECTING STRUCTURE OF SEMICONDUCTOR ELEMENT, LIQUID CRYSTAL DISPLAY DEVICE USING THE STRUCTURE, AND ELECTRONIC EQUIPMENT USING THE DISPLAY DEVICE

摘要

In a semiconductor element connecting structure which connects a semiconductor IC (7) on the surface of a substrate (13), an adhesive layer (31) which is interposed between the substrate (13) and the IC (7) is provided so as to stick the IC (7) to the substrate (13). The adhesive layer (31) has an ACF (32) which works as a bonding agent which bonds the IC (7) to the substrate (13) and a space (33) formed in the ACF (32). Since the thermal deformation and the like of the IC (7) is absorbed by the space (33), the connecting states of bumps (28) and (29) do not become unstable even when the IC (7) is deformed by heat, etc.