发明名称 METHOD AND APPARATUS FOR WIRE BONDING
摘要 PROBLEM TO BE SOLVED: To secure the reliability of a connection with a covered wire at a second position. SOLUTION: An energizing force is applied to a covered wire B in a direction approximately vertical to the axis core of this covered wire, during an interval from its leaving a wire spool 12 to its reaching a bonding tool 10, and a tensile strength is applied by the energizing force applied, in the opposite direction to that at a specified side to be bonded. At a part where this energizing force is applied, the covered wire 13 is recognized, and the state of sagging of the covered wire 13 is detected, and the rotation of the wire spool 12 is controlled is as to make the sagging always constant by the detected result. On the occasion of a ball-forming discharge to the tip of the covered wire 13 and a covered film removing discharge to a second joining scheduled region, a gas is blown against the electrode surface of a discharging electrode from an air blowing nozzle 16.
申请公布号 JPH1070149(A) 申请公布日期 1998.03.10
申请号 JP19970218805 申请日期 1997.08.13
申请人 HITACHI LTD 发明人 AKIYAMA YUKIJI
分类号 H01L21/60 主分类号 H01L21/60
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