| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper-clad laminated sheet especially excellent in heat resistance, low dielectric constant and low dielectric loss tangent without losing the characteristics of a conventional copper-clad laminated sheet obtained by using an epoxy resin. SOLUTION: This copper-clad laminated sheet is obtained by molding a prepreg obtained using a thermosetting resin compsn. containing an ester compd. represented by formula [wherein Ar and Ar' are a 6-20C aromatic group, P and Q are a hydrogen atom, a halogen atom, a 1-10C alkyl group, a 5-10C cycloalkyl group, a 6-20 aryl group or a 7-20C aralkyl group, Y and Z are a hydrogen atom or a 1-20C acyl group but at least one of Y and Z is a 1-20C acyl group, g and h are an integer of 0-4, m and n are an integer of 0-5 and X is a carbonyl group, a sulfone group, -CF2 or -C(CF3 )2 ], an epoxy resin and a curing catalyst and copper foil under heating. |
